Soldering Lead-Type LED Lamps
When soldering lead-type LED lamps, it is important to remember that, since transparent resin has a low softening temperature (glass transition temperature), one must carefully control the soldering temperature. Marktech further recommends that the following precautions be observed when soldering lead-type LED lamps:
Soldering Conditions
When soldering lead-type LED lamps to the PCB, please follow the soldering conditions shown below:
Lighting Method Main | Application | Advantages |
---|---|---|
Dynamic Lighting | Indoor display equipment using matrix wiring, light source for standard lighting using matrix wiring | Reduces the number of drive components, such as transistors, and lowers costs |
Static Lighting | Indicators, outdoor display equipment | Enables high-brightness design, minimizes flickering in applications such as road signs. |
Specific Handling Precautions for Specific Packages
3 Plastic Stem Package
- When mounting this kind of device on a 2.54-mm pitch standard PCB, make sure that the device body is more than 2 mm above the surface of the PC board as the leads are soldered.
- Do not apply mechanical stress from the top of the device
- Even when the device pitch matches the PCB specification, make sure the device is 1 mm or more away from the board.
- When using a through-hole board, make sure the device is raised 2mm or more above the board surface.
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